(China (Mainland))
Product Summary
The XCV150FGG256AFP deliver high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 5-layer-metal 0.22 mm CMOS process. These advances of the XCV150FGG256AFP make Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays. Building on experience gained from previous generations of FPGAs, the Virtex family represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the Virtex XCV150FGG256AFP delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
Parametrics
XCV150FGG256AFP maximum ratings: (1)VCCINT, supply voltage relative to GND: -0.5 to 3.0V; (2)VCCO, supply voltage relative to GND: -0.5 to 4.0V; (3)VREF, input reference voltage: -0.5 to 3.6V; (4)VIN, input voltage relative to GDN when using VREF: -0.5 to 3.6V; internal threshold: -0.5 to 5.5V; (5)VCC, longest supply voltage rise time from 1 to 2.3875V: 50ms; (6)TSTG, storage temperature: -65 to 150℃; (7)TJ, junction temperature, packages: +125℃
Features
XCV150FGG256AFP features: (1)Fast, high-density Field-Programmable Gate Arrays; (2)Multi-standard SelectIO. interfaces; (3)Built-in clock-management circuitry; (4)Hierarchical memory system; (5)Flexible architecture that balances speed and density; (6)Supported by FPGA Foundation. and Alliance Development Systems; (7)SRAM-based in-system configuration; (8)0.22mm 5-layer metal process; (9)100% factory tested.
Diagrams
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